MP4 | Video: h264, 1280x720 | Audio: AAC, 44.1 KHz, 2 ChGenre: eLearning | Language: English + srt | Duration: 31 lectures (55m) | Size: 308.7 MB

Become Expert In The Field Of "Advanced Electronics Material"
Need for electronics packaging
Different ICs packaging configurations
3 Packaging variations
Difference between various "FR" boards
Various Substrate materials
Materials used to form "Electronics Glass" & application of "Electronics Glass"
Various Ceramic Substrate materials that are currently being used and its technical details
Advanced "TIM" material : "GELVET"
Various metal matrix composites (MMCS) : Al-Diamond / AlSi / ASiC / Cu-Diamond / Al-Graphite
Role of Diamond
Carbon nanotubes (CNT) & its types : SWCNT / MWCNT
Applications of "CNTS"
Advanced materials used to form "PCM" - Phase Change Materials
Materials used for EMI (Electro-Magnetic Interference) shielding
No prior skills required
In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as - consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics .

Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, "electronics packaging" plays a very important part .
Here in this short course you will study in detail about the "advanced materials used in electronics packaging".
What you will learn in this course
What is electronics packaging
Why we need electronics packaging
6 Hierarchy in electronics packaging
3 Packaging variations
7 different types of packaging configurations & their applications
Different types of substrate materials
What is so great about FR4 board
Difference between FR1/2/3 & FR4 board properties
Materials used to form electronic glass substrate and application of electronic glass
In-depth knowledge on ceramic substrate materials
GELVET TIM technology
Metal matrix composite (MMCS) materials : Al-Si , Al-SiC ,Cu-Diamond , Al-Diamond , Gold-Gold Interconnections (GGI) & Al-Graphite composite
Technical details on Carbon Nano Tube (CNTS)
PCM materials
Electro-magnetic-interference (EMI) shielding materials
At the end of this course , a RESOURCE File is provided which will help you a lot in further understanding of the topics given in this course .
Power Electronics Students
Material Science Students
Students dealing with thermal management of electronics / electric products




DOWNLOAD
uploadgig.com