MP4 | Video: h264, 1280x720 | Audio: AAC, 44.1 KHz, 2 ChGenre: eLearning | Language: English + srt | Duration: 22 lectures (1h 5m) | Size: 237.4 MB

Become Thermal Analyst/Expert
The Reasons Behind The Need Of Thermal Management In The Field Of Electronics
How To Calculate 'heat Flow Rate' And 'thermal Resistance' In Parallel Connected Conductors
Technical Teologies (With Detailed Explanation) Assocciated With "Thermal Management" .

Indepth Details Of - Currently Used Thermal Management Techniques
Derivation On : Total Heat Flux & Total Thermal Resistance
Thermal And Electrical Equivalent Relationships
4 Thermal Designs Rules
What Advanced Thermal Management Techniques Has Been Recently Developed
No Prior Experience Is Needed As Well As No Knowledge About Any Software Is Required
My Name Is Riya B .s. Pal .
This Course Has Been Designed Looking At The Requirement By The Students . Through This Course , Students Will Come To Know The Existing Scenario Of The Electronics World . This Course Will Provide You In-depth Knowledge On The Below Topics :
Course Introduction / Why Thermal Management Is Important / Thermal Management Challenges At Level 1 (Chip Level) / Thermal Management Challenges At Level 2 (Pcb/board Level) / Thermal Management Challenges At Level 3 (Envelope / Packaging Level) / Skin Temperatur / Conduction , Convection & Radiation / Heat Flux & Heat Flow Rate / Calculation : Heat Transfer Rate (Conduction Method) / Thermal Resistance (Conduction Mode Of Heat Transfer) & Heat Transfer Coefficient / Thermal Conductivity / Newton's Law Of Cooling / To Calculate Total (Q) & Thermal Resistance (Rth) For A Parallel Connected Conductors / Reason Behind Electrical-thermal Equivalent Relationship / Equivalent Circuit Representation / Which Aluminum & Copper Alloy To Be Used For Heat Sink / All About Tim's (Thermal Interface Materials) / Tim (Thermal Paste) V/s Tim (Thermal Pads) V/s (Thermal Gel) V/s (Thermal Liquid Gap Fillers) / Tim (Pcm : Phase Change Materials) / Design Rules Number 1 : Controlling The Working Temperature Of The Components / Design Rules Number 2 : Using Multi-layered / Single Layerd Pcb Metal Core Board / Design Rules Number 3 : Placement Of The Heat Source / Design Rules Number 4 : Components Assembly / Advanced Thermal Materials ( Al-diamond / Al-sic / Al-si / Cu- Matrix ).
This Course Is For All The Students Belog To Electronics / Mechanical / Electrical / Thermodynamics Fields




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