Thermal Stresses: Design, Behavior and Applications
Nova | English | 2016 | ISBN-10: 1634853733 | 230 pages | PDF | 7.77 mb
by Alfred R. Webb (Editor)

Thermal stresses which originate as a consequence of different thermal expansion coefficients of components of multi-component materials represent an important phenomenon in multi-component materials. These stresses are usually investigated by computational and experimental methods are still of interest to materials scientists and engineers. In this book, the design, behavior and applications of thermal stresses are discussed. Chapter One introduces a full three-dimensional, non-isothermal computational fluid dynamics (CFD) model of an operating PEM fuel cell which was developed to simulate the thermal stresses inside the cell. Chapter Two deals with mutual comparison of different analytical models of thermal stresses in a multi-particle-matrix system with isotropic spherical particles which are periodically distributed in an isotropic infinite matrix. Chapter Three deals with an analytical model of thermal stresses originating during a cooling process of an anisotropic solid elastic continuum. Chapter Four provides an analysis on thermal loads of nozzle in low-temperature reactor piping. Chapter Five investigates the influence of the thermal stresses on the performances of the integrated-planar solid oxide fuel cell IP-SOFC and essentially the durability of the cell elements which is a major technical barrier to the commercial viability. Chapter Six studies the amino nitrogen metabolism of Saccharomyces cerevisiae as it is protected by SO2 under thermal stress.